LOTUS–X
Wire Bonding
Wire bond your chip to our proprietary 255-pin chip carrier with ease, or leverage our expert team to handle the process for you.
More Options
Wire bonding isn’t your only option. Our platform is designed for seamless integration with a variety of external test equipment. You can connect to a probe station for on-wafer characterization or to other measurement instruments using coaxial cables and standard interfaces.
Device Integration
Integrate your device seamlessly with our pre-made or custom modules. Our modules provide full access to a robust set of resources, including 32 Pulsed Source-Measure Units (SMUs), 32 General Purpose I/O (GPIOs), 3 variable and 2 fixed power supplies, and integrated CPU and FPGA for powerful data processing and control.
LOTUS-X
Introducing LOTUS-X, the core of our solution. This device enables you to accelerate your testing cycles and dramatically reduce time-to-market. With our user-friendly Python library, you can rapidly create any test bench imaginable. You have the flexibility to develop your own custom code or partner with our team of experts to create a bespoke solution for your unique project.
